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Proceedings Paper

A reflection TIE system for 3D inspection of wafer structures
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Paper Abstract

A reflection TIE system consisting of a reflecting microscope and a 4f relay system is presented in this paper, with which the transport of intensity equation (TIE) is applied to reconstruct the three-dimensional (3D) profile of opaque micro objects like wafer structures for 3D inspection. As the shape of an object can affect the phases of waves, the 3D information of the object can be easily acquired with the multiple phases at different refocusing planes. By electronically controlled refocusing, multi-focal images can be captured and used in solving TIE to obtain the phase and depth of the object. In order to validate the accuracy and efficiency of the proposed system, the phase and depth values of several samples are calculated, and the experimental results is presented to demonstrate the performance of the system.

Paper Details

Date Published: 24 October 2017
PDF: 6 pages
Proc. SPIE 10458, AOPC 2017: 3D Measurement Technology for Intelligent Manufacturing, 104580H (24 October 2017);
Show Author Affiliations
Yizhen Yan, Peking Univ. (China)
Weijuan Qu, Ngee Ann Polytechnic (Singapore)
Lei Yan, Peking Univ. (China)
Zhaomin Wang, Nanyang Technological Univ. (Singapore)
Hongying Zhao, Peking Univ. (China)

Published in SPIE Proceedings Vol. 10458:
AOPC 2017: 3D Measurement Technology for Intelligent Manufacturing
Wolfgang Osten; Anand Krishna Asundi; Huijie Zhao, Editor(s)

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