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Proceedings Paper

Process window discovery from mask inspection for hotspot analysis and verification
Author(s): James Cheng; William Chou; C. H. Twu; Hsin-Fu Chou; Jackie Cheng; Colbert Lu; Heng-Jen Lee; Bosheng Zhang; Mehdi Daneshpanah; Apo Sezginer; David Wu; Mike Yeh; Albert Chien
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Paper Abstract

A new technology transforms mask inspection images through focus into 3D lithography images in resist. This enables early detection and ranking of hotspots, and distinguishes mask-induced and process-induced hotspots. The results can be used in several ways including: 1) feed back to OPC teams to improve process window; 2) feed forward to the litho team for scanner adjustment; and, 3) feed forward to wafer inspection in the form of care areas to reduce time to result for wafer-based process window discovery.

Paper Details

Date Published: 16 October 2017
PDF: 8 pages
Proc. SPIE 10451, Photomask Technology 2017, 104510X (16 October 2017);
Show Author Affiliations
James Cheng, United Microelectronics Corp. (Taiwan)
William Chou, United Microelectronics Corp. (Taiwan)
C. H. Twu, United Microelectronics Corp. (Taiwan)
Hsin-Fu Chou, United Microelectronics Corp. (Taiwan)
Jackie Cheng, Photronics DNP Semiconductor Mask Corp. (Taiwan)
Colbert Lu, Photronics DNP Semiconductor Mask Corp. (Taiwan)
Heng-Jen Lee, Photronics DNP Semiconductor Mask Corp. (Taiwan)
Bosheng Zhang, KLA-Tencor Corp. (United States)
Mehdi Daneshpanah, KLA-Tencor Corp. (United States)
Apo Sezginer, KLA-Tencor Corp. (United States)
David Wu, KLA-Tencor Corp. (Taiwan)
Mike Yeh, KLA-Tencor Corp. (Taiwan)
Albert Chien, KLA-Tencor Corp. (Taiwan)

Published in SPIE Proceedings Vol. 10451:
Photomask Technology 2017
Peter D. Buck; Emily E. Gallagher, Editor(s)

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