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Proceedings Paper

Through-Silicon-Vias (TSVs) for 3D readout of ASIC for nearly gapless CdZnTe detector arrays
Author(s): J. Hong; B. Allen; J. Grindlay; Hiromasa Miyasaka; Jill Burnham; Sangki Hong; Wesker Lei; Scott Barthelmy; Robert Patti; Fiona Harrison
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Paper Abstract

Wirebonds, although proven for space application and perceived necessary for hybrid sensors like CdZnTe (CZT) detectors, introduce assembly complexity and undesirable gaps between detector units. Thus, they pose a serious challenge in building a low cost large area detector. We are developing Through-Silicon Vias (TSVs) to make all connections (both power and data) through ASICs, which will eliminate wirebonds and enable simple direct flip-chip bonding between the ASIC and a substrate electronics layer. TSVs also enable a more compact layout of the ASIC, which reduces the inactive area of the detector plane, and thus enables nearly gaplessly tilable detector arrays. We demonstrate the first successful TSV implementation on ASICs used for CZT detectors onboard the Nuclear Spectroscopic Telescope Array (NuSTAR) mission as part of our program to develop large area CZT imagers for wide field coded aperture imaging.

Paper Details

Date Published: 15 September 2017
PDF: 8 pages
Proc. SPIE 10392, Hard X-Ray, Gamma-Ray, and Neutron Detector Physics XIX, 103920U (15 September 2017); doi: 10.1117/12.2274360
Show Author Affiliations
J. Hong, Harvard-Smithsonian Ctr. for Astrophysics (United States)
B. Allen, Harvard-Smithsonian Ctr. for Astrophysics (United States)
J. Grindlay, Harvard-Smithsonian Ctr. for Astrophysics (United States)
Hiromasa Miyasaka, CalTech (United States)
Jill Burnham, CalTech (United States)
Sangki Hong, Tezzaron Semiconductor Corp. (United States)
Wesker Lei, Novati Technologies Inc. (United States)
Scott Barthelmy, NASA Goddard Space Flight Ctr. (United States)
Robert Patti, Tezzaron Semiconductor Corp. (United States)
Fiona Harrison, CalTech (United States)

Published in SPIE Proceedings Vol. 10392:
Hard X-Ray, Gamma-Ray, and Neutron Detector Physics XIX
Arnold Burger; Ralph B. James; Michael Fiederle; Larry Franks; Stephen A. Payne, Editor(s)

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