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Proceedings Paper

Packaging of ultra-high speed optical fiber data interconnects
Author(s): Martin Zoldak; Leos Halmo; Jaroslaw P. Turkiewicz; Stefan Schumann; Ronny Henker
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Paper Abstract

The ever increasing data traffic in data centers requires development of new optical fiber transmission technologies. One of the key challenges is development of packaging techniques that can allow low-cost manufacturing of optical data interconnects with the data rates 50+ Gb/s. Such packaging techniques on one hand need to provide reliable connection to the optical fiber on the other hand interface the modules with the high-speed electrical signals. In this paper we introduce the concept for the packaging of the data interconnect transceiver modules that allow operation up to 56 Gb/s. The packaging of data interconnects is based on high accuracy micro assembly. Further investigations on the electrooptical chip lanes in GSGSG and GSSG configurations are presented and impact on the system performance is shown. The obtained results indicate possibility to realize the packaging of electro-optical components up to 100 Gb/s non-return to zero (NRZ) data rates.

Paper Details

Date Published: 10 February 2017
PDF: 8 pages
Proc. SPIE 10325, Optical Fibers and Their Applications 2017, 103250R (10 February 2017); doi: 10.1117/12.2271032
Show Author Affiliations
Martin Zoldak, Argotech a.s. (Czech Republic)
Leos Halmo, Argotech a.s. (Czech Republic)
Jaroslaw P. Turkiewicz, Warsaw Univ. of Technology (Poland)
Stefan Schumann, TU Dresden (Germany)
Ronny Henker, TU Dresden (Germany)

Published in SPIE Proceedings Vol. 10325:
Optical Fibers and Their Applications 2017
Jan Dorosz; Ryszard S. Romaniuk, Editor(s)

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