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Proceedings Paper

Spatial calibration and image processing requirements of an image fiber bundle based snapshot hyperspectral imaging probe: from raw data to datacube
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Paper Abstract

Hyperspectral imaging was first used in remote sensing and since then, it has been used in many other applications such as cancer diagnosis, precision farming and assessment of the level of flaking in ancient murals. In order to make hyperspectral imaging available for a wide variety of applications, its imagers can be made to operate using different methods and developed into different configurations. This leads to each variant having a set of specifications suitable for certain applications. The many variants of hyperspectral imager produce a set of three-dimensional spatial-spatialspectral datacube, which is made up of hundreds of spectral images of one scene. A snapshot hyperspectral imaging probe has recently been developed by integrating a fiber bundle, which is made up of specially-arranged optical fibers, with a spectrograph-based hyperspectral imager. The snapshot method is able to produce a datacube using the information from each scan. The fiber bundle has 100 fiberlets which are arranged in a row in the one-dimensional proximal end, and are rearranged into a 10×10 hexagonal array in the two-dimensional distal end. The image captured by the two-dimensional end of the fiber bundle is reduced from two to one spatial dimension at the one-dimensional end. The raw data acquired from each scan has to be remapped into a datacube with the correct representation of the spectral and spatial features of the captured scene. This paper reports the spatial calibrations of both ends of the fiber bundle and image processing that have to be performed for such a remapping.

Paper Details

Date Published: 13 June 2017
PDF: 6 pages
Proc. SPIE 10449, Fifth International Conference on Optical and Photonics Engineering, 104491P (13 June 2017); doi: 10.1117/12.2270739
Show Author Affiliations
Hoong-Ta Lim, Nanyang Technological Univ. (Singapore)
Vadakke Matham Murukeshan, Nanyang Technological Univ. (Singapore)

Published in SPIE Proceedings Vol. 10449:
Fifth International Conference on Optical and Photonics Engineering
Anand Krishna Asundi, Editor(s)

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