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Proceedings Paper

Scatterometry for advanced process control in semiconductor device manufacturing
Author(s): Arie den Boef; Hugo Cramer; Stefan Petra; Bastiaan Onne Fagginger Auer; Jolanda Schmetz-Schagen; Armand Koolen; Olaf van Loon; Gudrun de Gersem; Pieter Klandermans; Eric Bakker
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Paper Abstract

A concise explanation of spectroscopic scatterometry is presented that is used for modelbased shape metrology of etched features in the production of Memory and Logic semiconductor devices. We also present an angle-resolved scatterometry technique that can measure at high throughput on very small test targets. First measured results are shown that demonstrate the capability on 5×5 μm2 targets.

Paper Details

Date Published: 13 June 2017
PDF: 8 pages
Proc. SPIE 10449, Fifth International Conference on Optical and Photonics Engineering, 1044916 (13 June 2017); doi: 10.1117/12.2270595
Show Author Affiliations
Arie den Boef, ASML Netherlands B.V. (Netherlands)
Hugo Cramer, ASML Netherlands B.V. (Netherlands)
Stefan Petra, ASML Netherlands B.V. (Netherlands)
Bastiaan Onne Fagginger Auer, ASML Netherlands B.V. (Netherlands)
Jolanda Schmetz-Schagen, ASML Netherlands B.V. (Netherlands)
Armand Koolen, ASML Netherlands B.V. (Netherlands)
Olaf van Loon, ASML Netherlands B.V. (Netherlands)
Gudrun de Gersem, ASML Netherlands B.V. (Netherlands)
Pieter Klandermans, ASML Netherlands B.V. (Netherlands)
Eric Bakker, ASML Netherlands B.V. (Netherlands)

Published in SPIE Proceedings Vol. 10449:
Fifth International Conference on Optical and Photonics Engineering
Anand Krishna Asundi, Editor(s)

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