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Proceedings Paper

Development of batch producible hot embossing 3D nanostructured surface-enhanced Raman scattering chip technology
Author(s): Chu-Yu Huang; Ming-Shiuan Tsai
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Paper Abstract

The main purpose of this study is to develop a batch producible hot embossing 3D nanostructured surface-enhanced Raman chip technology for high sensitivity label-free plasticizer detection. This study utilizing the AAO self-assembled uniform nano-hemispherical array barrier layer as a template to create a durable nanostructured nickel mold. With the hot embossing technique and the durable nanostructured nickel mold, we are able to batch produce the 3D Nanostructured Surface-enhanced Raman Scattering Chip with consistent quality. In addition, because of our SERS chip can be fabricated by batch processing, the fabrication cost is low. Therefore, the developed method is very promising to be widespread and extensively used in rapid chemical and biomolecular detection applications.

Paper Details

Date Published: 6 September 2017
PDF: 7 pages
Proc. SPIE 10356, Nanostructured Thin Films X, 103560R (6 September 2017); doi: 10.1117/12.2270472
Show Author Affiliations
Chu-Yu Huang, National Chung Hsing Univ. (Taiwan)
Ming-Shiuan Tsai, National Chung Hsing Univ. (Taiwan)

Published in SPIE Proceedings Vol. 10356:
Nanostructured Thin Films X
Yi-Jun Jen; Akhlesh Lakhtakia; Tom G. Mackay, Editor(s)

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