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Proceedings Paper

Out of the lab and into the fab: Nano-alignment as an enabler for Silicon Photonics’ next chapter
Author(s): Scott Jordan
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Paper Abstract

The rapid advent of Silicon Photonics presents many challenges for test and packaging. Here we concisely review SiP device attributes that differ significantly from classical photonic configurations, with a view to the future beyond current, connectivity-oriented silicon photonics developments, looking to such endeavors as all-optical computing and quantum computing. The necessity for nano-precision alignment of optical elements in test and packaging operations quickly emerges as the unfilled need. We review the industrial test and packaging solutions developed back in the 1997-2001 photonics boom to address the needs of that era's devices, and map their gaps with the new SiP device classes. Finally we review the new state-of-the-art of recent advances in the field that address these gaps.

Paper Details

Date Published: 13 June 2017
PDF: 8 pages
Proc. SPIE 10449, Fifth International Conference on Optical and Photonics Engineering, 104490Z (13 June 2017); doi: 10.1117/12.2270400
Show Author Affiliations
Scott Jordan, PI (Physik Instrumente) L.P. (United States)

Published in SPIE Proceedings Vol. 10449:
Fifth International Conference on Optical and Photonics Engineering
Anand Krishna Asundi, Editor(s)

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