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Proceedings Paper

Ultra-fine grinding of silicate materials under the use of new resin bond diamond tools
Author(s): Sebastian Henkel; Jens Bliedtner; Edda Rädlein; Christian Schulze; Matthias Rost; Martin Gerhardt; Michael Fuhr
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Paper Abstract

The fabrication of high-quality optical components involves great effort. Polishing often functions as the final step in a manufacturing chain. To reduce the conventionally time-consuming, complex polishing process with loose grain, an interesting approach with novel resin bond grinding tools is presented for surface smoothing. Various processing-experiments were carried out, regarding different silicate materials such as BK7® and fused silica. Among other results it is shown, that good surface qualities with low roughness down to Ra = 8 nm or Rq = 10 nm can be achieved so far, a quality that already allows speaking of “ultra-fine” grinding. This results in remarkable possibilities to reduce conventional fine-machining procedures with loose abrasives. The fine grinded components can directly be polished to finally smooth the surface and remove remaining defects. Total-processing-times can be strongly reduced, involving significant economic advantages.

Paper Details

Date Published: 15 June 2017
PDF: 6 pages
Proc. SPIE 10326, Fourth European Seminar on Precision Optics Manufacturing, 1032605 (15 June 2017); doi: 10.1117/12.2269500
Show Author Affiliations
Sebastian Henkel, Ernst-Abbe Univ. of Applied Sciences, Jena (Germany)
Jens Bliedtner, Ernst-Abbe Univ. of Applied Sciences, Jena (Germany)
Edda Rädlein, Technical Univ. Ilmenau (Germany)
Christian Schulze, Ernst-Abbe Univ. of Applied Sciences, Jena (Germany)
Matthias Rost, Ernst-Abbe Univ. of Applied Sciences, Jena (Germany)
Martin Gerhardt, Günter Effgen GmbH (Germany)
Michael Fuhr, Günter Effgen GmbH (Germany)

Published in SPIE Proceedings Vol. 10326:
Fourth European Seminar on Precision Optics Manufacturing
Oliver W. Fähnle; Rolf Rascher; Christine Wünsche, Editor(s)

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