Share Email Print

Proceedings Paper

A 3D stacked global-shutter image sensor with pixel-level interconnection technology for high-speed image capturing
Author(s): T. Kondo; Y. Takemoto; N. Takazawa; M. Tsukimura; H. Saito; H. Kato; J. Aoki; S. Suzuki; Y. Gomi; S. Matsuda; Y. Tadaki
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

We have developed a 3D stacked 16M-pixel, 3.8-μm pixel pitch, global-shutter CMOS image sensor with pixel level interconnections using four million micro bumps. The four photodiodes in the unit pixel circuit on the top substrate share one micro-bump interconnection at a 7.6-μm pitch. Each signal of the photodiodes is transferred to the corresponding storage node on the bottom substrate via the micro bump. This 3D architecture gives the image sensor not only a 16M-pixel global-shutter function but also a 2M-pixel 10K-fps high-speed image capturing mode with a burst of eight images. In this paper, we report on the improvement in the high-speed image capturing mode to operate at up to 100K fps by optimizing the timing for the higher-speed |image capturing with 2M-pixel resolution. In addition, we estimated the further potential of the 3D image sensor for high-speed image capturing to make the most of the 3D structure, which comprised one photodiode in the pixel unit circuit on the top substrate and electrically connected multiple storage nodes on the bottom substrate. This enables the image sensor to capture a burst of as many frames as the number of storage nodes in the pixel unit without sacrificing a photodiode and have better sensitivity with photodiodes fully occupying the chip surface with bigger photodiodes than when using conventional sensors. These results demonstrate that our 3D stacking technology pushes the envelope of capturing high-speed images with monolithic sensors.

Paper Details

Date Published: 20 February 2017
PDF: 6 pages
Proc. SPIE 10328, Selected Papers from the 31st International Congress on High-Speed Imaging and Photonics, 1032804 (20 February 2017); doi: 10.1117/12.2269058
Show Author Affiliations
T. Kondo, Olympus Corp. (Japan)
Y. Takemoto, Olympus Corp. (Japan)
N. Takazawa, Olympus Corp. (Japan)
M. Tsukimura, Olympus Corp. (Japan)
H. Saito, Olympus Corp. (Japan)
H. Kato, Olympus Corp. (Japan)
J. Aoki, Olympus Corp. (Japan)
S. Suzuki, Olympus Corp. (Japan)
Y. Gomi, Olympus Corp. (Japan)
S. Matsuda, Olympus Corp. (Japan)
Y. Tadaki, Olympus Corp. (Japan)

Published in SPIE Proceedings Vol. 10328:
Selected Papers from the 31st International Congress on High-Speed Imaging and Photonics
T. Goji Etoh; Hiroyuki Shiraga, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?