Share Email Print

Proceedings Paper

Integrated TiN coated porous silicon supercapacitor with large capacitance per foot print
Author(s): Kestutis Grigoras; Leif Grönberg; Jouni Ahopelto; Mika Prunnila
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

We have fabricated a micro-supercapacitor with porous silicon electrodes coated with TiN by atomic layer deposition technique. The coating provides an efficient surface passivation and high electrical conductivity of the electrodes, resulting in stable and almost ideal electrochemical double layer capacitor behavior with characteristics comparable to the best carbon based micro-supercapacitors. Stability of the supercapacitor is verified by performing 50 000 voltammetry cycles with high capacitance retention obtained. Silicon microfabrication techniques facilitate integration of both supercapacitor electrodes inside the silicon substrate and, in this work, such in-chip supercapacitor is demonstrated. This approach allows realization of very high capacitance per foot print area. The in-chip micro-supercapacitor can be integrated with energy harvesting elements and can be used in wearable and implantable microdevices.

Paper Details

Date Published: 30 May 2017
PDF: 7 pages
Proc. SPIE 10246, Smart Sensors, Actuators, and MEMS VIII, 102460Z (30 May 2017); doi: 10.1117/12.2266603
Show Author Affiliations
Kestutis Grigoras, VTT Technical Research Ctr. of Finland Ltd. (Finland)
Leif Grönberg, VTT Technical Research Ctr. of Finland Ltd. (Finland)
Jouni Ahopelto, VTT Technical Research Ctr. of Finland Ltd. (Finland)
Mika Prunnila, VTT Technical Research Ctr. of Finland Ltd. (Finland)

Published in SPIE Proceedings Vol. 10246:
Smart Sensors, Actuators, and MEMS VIII
Luis Fonseca; Mika Prunnila; Erwin Peiner, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?