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Proceedings Paper

Interlocked by nanoscale sculpturing: pure aluminum copper contacts (Conference Presentation)
Author(s): Melike Gerngross-Baytekin; Mark Daniel Gerngross; Jürgen Carstensen; Rainer Adelung

Paper Abstract

Connecting metals reliable with different corrosion potential is a well-known challenge. An extreme example are copper aluminum contacts. Galvanic corrosion occurs if the two different metals are in contact with each other and an electrolyte, the aluminum becomes susceptible to corrosion under current flow. Usually, antioxidant pastes containing metals are employed but create difficulties e.g. for fatigue resistant power electronic connections.

The recently described process of nanoscale sculpturing [1] offers an alternative. Usually, if the surface of metals like aluminium are prepared they are just arbitrary cuts through the bulk. There is no optimization of the surface grain structure towards stability at all. Neither the crystalline facets in the grains are in their most stable orientation nor is the protective oxide shell the most stable one. The nanoscale sculpturing approach is carving out the most stable grains and planes by chemical or electrochemical treatment. The decisive trick is that the chemistry is targeting towards the instable oxide and not the metal. Aluminium sample surfaces including alloys like AA575 exhibit afterwards single crystalline surface facets covered with nanoscale stable oxide films. Galvanically deposited copper forms extremely reliable interlocked connections on top, even allowing for soldering on top of their surface.

Paper Details

Date Published: 16 June 2017
PDF: 1 pages
Proc. SPIE 10248, Nanotechnology VIII, 102480U (16 June 2017); doi: 10.1117/12.2265800
Show Author Affiliations
Melike Gerngross-Baytekin, Christian-Albrechts-Univ. zu Kiel (Germany)
Mark Daniel Gerngross, Christian-Albrechts-Univ. zu Kiel (Germany)
Jürgen Carstensen, Christian-Albrechts-Univ. zu Kiel (Germany)
Rainer Adelung, Christian-Albrechts-Univ. zu Kiel (Germany)

Published in SPIE Proceedings Vol. 10248:
Nanotechnology VIII
Ion M. Tiginyanu, Editor(s)

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