
Proceedings Paper
Realization of optical multimode TSV waveguides for Si-Interposer in 3D-chip-stacksFormat | Member Price | Non-Member Price |
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Paper Abstract
Optical connectivity has the potential to outperform copper-based TSVs in terms of bandwidth at the cost of more complexity due to the required electro-optical and opto-electrical conversion. The continuously increasing demand for higher bandwidth pushes the breakeven point for a profitable operation to shorter distances. To integrate an optical communication network in a 3D-chip-stack optical through-silicon vertical VIAs (TSV) are required. While the necessary effort for the electrical/optical and vice versa conversion makes it hard to envision an on-chip optical interconnect, a chip-to-chip optical link appears practicable. In general, the interposer offers the potential advantage to realize electro-optical transceivers on affordable expense by specific, but not necessarily CMOS technology. We investigated the realization and characterization of optical interconnects as a polymer based waveguide in high aspect ratio (HAR) TSVs proved on waferlevel.
To guide the optical field inside a TSV as optical-waveguide or fiber, its core has to have a higher refractive index than the surrounding material. Comparing different material / technology options it turned out that thermal grown silicon dioxide (SiO2) is a perfect candidate for the cladding (nSiO2 = 1.4525 at 850 nm). In combination with SiO2 as the adjacent polymer layer, the negative resist SU-8 is very well suited as waveguide material (nSU-8 = 1.56) for the core. Here, we present the fabrication of an optical polymer based multimode waveguide in TSVs proved on waferlevel using SU-8 as core and SiO2 as cladding. The process resulted in a defect-free filling of waveguide TSVs with SU-8 core and SiO2 cladding up to aspect ratio (AR) 20:1 and losses less than 3 dB.
Paper Details
Date Published: 16 May 2017
PDF: 9 pages
Proc. SPIE 10232, Micro-structured and Specialty Optical Fibres V, 102320T (16 May 2017); doi: 10.1117/12.2265168
Published in SPIE Proceedings Vol. 10232:
Micro-structured and Specialty Optical Fibres V
Kyriacos Kalli; Jiri Kanka; Alexis Mendez; Pavel Peterka, Editor(s)
PDF: 9 pages
Proc. SPIE 10232, Micro-structured and Specialty Optical Fibres V, 102320T (16 May 2017); doi: 10.1117/12.2265168
Show Author Affiliations
S. Killge, TU Dresden (Germany)
S. Charania, TU Dresden (Germany)
K. Richter, TU Dresden (Germany)
N. Neumann, TU Dresden (Germany)
S. Charania, TU Dresden (Germany)
K. Richter, TU Dresden (Germany)
N. Neumann, TU Dresden (Germany)
Z. Al-Husseini, TU Dresden (Germany)
D. Plettemeier, TU Dresden (Germany)
J. W. Bartha, TU Dresden (Germany)
D. Plettemeier, TU Dresden (Germany)
J. W. Bartha, TU Dresden (Germany)
Published in SPIE Proceedings Vol. 10232:
Micro-structured and Specialty Optical Fibres V
Kyriacos Kalli; Jiri Kanka; Alexis Mendez; Pavel Peterka, Editor(s)
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