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Proceedings Paper • Open Access

Metrology challenges for in-line process control
Author(s): Philippe Leray

Paper Abstract

The future of in-line process control is challenged by the incoming revolution of 3D architecture and complex integration schemes. CD and thin film metrology challenges being already covered [1], this paper will focus on overlay metrology challenge for in-line process control. . After an overview of the existing techniques, we will discuss the dominant errors, real and artificial. Then we will discuss of the importance of consistency vs accuracy. After few words about the importance of sampling, we will show that accuracy, if desirable, is not reachable to the last nanometer. To enable a good process control the efforts of our industry must remained focus on consistency of overlay metrology versus process effects.

Paper Details

Date Published: 21 April 2017
PDF: 15 pages
Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 1014503 (21 April 2017); doi: 10.1117/12.2264717
Show Author Affiliations
Philippe Leray, IMEC (Belgium)

Published in SPIE Proceedings Vol. 10145:
Metrology, Inspection, and Process Control for Microlithography XXXI
Martha I. Sanchez, Editor(s)

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