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Proceedings Paper

On the modeling and characterization of an interlocked flexible electronic skin
Author(s): Nazanin Khalili; Xuechen Shen; Hani E. Naguib
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Paper Abstract

Development of an electronic skin with ultra-high pressure sensitivity is now of critical importance due its broad range of applications including prosthetic skins and biomimetic robotics. Microstructured conductive composite elastomers can acquire mechanical and electrical properties analogous to those of natural skin. One of the most prominent features of human skin is its tactile sensing property which can be mimicked in an electronic skin. Herein, an electrically conductive composite comprising polydimethylsiloxane and conductive fillers is used as a flexible and stretchable piezoresistive sensor. The electrical conductivity is induced within the elastomer matrix via carbon nanotubes whereas the piezoresistivity is obtained by means of microstructuring the surface of the substrate. An interlocked array of pyramids in micro-scale allows the change in the contact resistance between two thin layers of the composite upon application of an external load. Deformation of the interlocked arrays endows the sensor with an ultra-high sensitivity to the external pressures within the range of human skin perception. Moreover, using finite element analysis, the change in the contact are between the two layers was captured for different geometries. The structure of the sensor can be optimized through an optimization model in order to acquire maximum sensitivity.

Paper Details

Date Published: 12 April 2017
PDF: 6 pages
Proc. SPIE 10168, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2017, 101680C (12 April 2017); doi: 10.1117/12.2263980
Show Author Affiliations
Nazanin Khalili, Univ. of Toronto (Canada)
Xuechen Shen, Univ. of Toronto (Canada)
Hani E. Naguib, Univ. of Toronto (Canada)

Published in SPIE Proceedings Vol. 10168:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2017
Jerome P. Lynch, Editor(s)

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