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Proceedings Paper

Three-dimensional metrology for printed electronics
Author(s): Vadim Bromberg; Kevin Harding
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Paper Abstract

Novel materials and printing technologies can enable rapid and low cost prototyping and manufacturing of electronic devices with increased flexibility and complexity. However, robust and on-demand printing of circuits will require accurate metrology methods that can measure micron level patterns to verify proper production. This paper presents an evaluation of a range of optical gaging tools ranging from confocal to area 3D systems to determine metrological capability for a range of key parameters from trace thickness to solder paste volumes. Finally, this paper will present a select set of optimized measurement tools detailing both capabilities and gaps in the available technologies needed to fully realize the potential of printed electronics.

Paper Details

Date Published: 1 May 2017
PDF: 9 pages
Proc. SPIE 10220, Dimensional Optical Metrology and Inspection for Practical Applications VI, 102200I (1 May 2017); doi: 10.1117/12.2263475
Show Author Affiliations
Vadim Bromberg, GE Global Research (United States)
Kevin Harding, GE Global Research (United States)


Published in SPIE Proceedings Vol. 10220:
Dimensional Optical Metrology and Inspection for Practical Applications VI
Kevin G. Harding; Song Zhang, Editor(s)

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