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Proceedings Paper • Open Access

Increasing component functionality via multi-process additive manufacturing
Author(s): Jose L. Coronel Jr.; Katherine H. Fehr; Dominic D. Kelly; David Espalin; Ryan B. Wicker

Paper Abstract

Additively manufactured components, although extensively customizable, are often limited in functionality. Multi-process additive manufacturing (AM) grants the ability to increase the functionality of components via subtractive manufacturing, wire embedding, foil embedding and pick and place. These processes are scalable to include several platforms ranging from desktop to large area printers. The Multi3D System is highlighted, possessing the capability to perform the above mentioned processes, all while transferring a fabricated component with a robotic arm. Work was conducted to fabricate a patent inspired, printed missile seeker. The seeker demonstrated the advantage of multi-process AM via introduction of the pick and place process. Wire embedding was also explored, with the successful interconnect of two layers of embedded wires in different planes. A final demonstration of a printed contour bracket, served to show the reduction of surface roughness on a printed part is 87.5% when subtractive manufacturing is implemented in tandem with AM. Functionality of the components on all the cases was improved. Results included optical components embedded within the printed housing, wires embedded with interconnection, and reduced surface roughness. These results highlight the improved functionality of components through multi-process AM, specifically through work conducted with the Multi3D System.

Paper Details

Date Published: 18 May 2017
PDF: 8 pages
Proc. SPIE 10194, Micro- and Nanotechnology Sensors, Systems, and Applications IX, 101941F (18 May 2017); doi: 10.1117/12.2263257
Show Author Affiliations
Jose L. Coronel Jr., The Univ. of Texas at El Paso (United States)
Katherine H. Fehr, The Univ. of Texas at El Paso (United States)
Dominic D. Kelly, The Univ. of Texas at El Paso (United States)
David Espalin, The Univ. of Texas at El Paso (United States)
Ryan B. Wicker, The Univ. of Texas at El Paso (United States)

Published in SPIE Proceedings Vol. 10194:
Micro- and Nanotechnology Sensors, Systems, and Applications IX
Thomas George; Achyut K. Dutta; M. Saif Islam, Editor(s)

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