Share Email Print
cover

Proceedings Paper

Large format high SNR SWIR HgCdTe/Si FPA with multiple-choice gain for hyperspectral detection
Author(s): Xiaoning Hu; Aibo Huang; Qingjun Liao; Lu Chen; Xin Chen; Hua Fan; Honglei Chen; Ruijun Ding; Li He; Dexin Sun; Yinnian Liu
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

This paper reports the development of 2000×256 format SWIR HgCdTe/Si FPA with multiple-choice gain (i.e. multiple-choice charge handling capacity) for hyperspectral detection. The spectral resolution is about 8nm. To meet the demands of variable low flux detection within each spectral band in the short wave infrared range, low dark current, low noise, variable conversion gains and high SNR (Signal to Noise Ratio) of FPA are needed. In this paper, we fabricate 512×512 pixel 30μm pitch SWIR HgCdTe diode array on Si by using a novel stress-release construction of HgCdTe chip on Si. Moreover, we design low noise, variable conversion gain and large dynamic range read-out integrated circuit (ROIC) and hybridized the ROIC on the HgCdTe diode array on Si substrate. There are 8-choice gains which can be selected locally according to the incident flux to meet high SNR detection demand. By high-accuracy splicing 4 512×512 HgCdTe/Si FPA we get mosaic 2000×512 FPA, and characterizations have been carried out and reveal that the array dark current densities on an order of 10-10A/cm2, quantum efficiency exceeding 70%, and the operability of 99.5% at operating temperature of around 110K. The SNR of this FPA achieved 120 when illuminated under 5×104photons/pixel.

Paper Details

Date Published: 28 April 2017
PDF: 10 pages
Proc. SPIE 10213, Hyperspectral Imaging Sensors: Innovative Applications and Sensor Standards 2017, 102130E (28 April 2017); doi: 10.1117/12.2262912
Show Author Affiliations
Xiaoning Hu, Shanghai Institute of Technical Physics (China)
Aibo Huang, Shanghai Institute of Technical Physics (China)
Qingjun Liao, Shanghai Institute of Technical Physics (China)
Lu Chen, Shanghai Institute of Technical Physics (China)
Xin Chen, Shanghai Institute of Technical Physics (China)
Hua Fan, Shanghai Institute of Technical Physics (China)
Honglei Chen, Shanghai Institute of Technical Physics (China)
Ruijun Ding, Shanghai Institute of Technical Physics (China)
Li He, Shanghai Institute of Technical Physics (China)
Dexin Sun, Shanghai Institute of Technical Physics (China)
Yinnian Liu, Shanghai Institute of Technical Physics (China)


Published in SPIE Proceedings Vol. 10213:
Hyperspectral Imaging Sensors: Innovative Applications and Sensor Standards 2017
David P. Bannon, Editor(s)

© SPIE. Terms of Use
Back to Top
PREMIUM CONTENT
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?
close_icon_gray