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Proceedings Paper

High-volume manufacturing compatible dry development rinse process (DDRP): patterning and defectivity performance for EUVL
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Paper Abstract

There are many knobs available that change the chemical and physical properties of the photoresists to "break" the RLS (Resolution, Sensitivity, Line edge/width roughness) trade-off, however those are not enough today to realize a material to satisfy all requirements at once for 7nm technology and beyond. DDRP improves the ultimate achievable resolution via pattern collapse mitigation, hence the priority of requirements for the EUV photoresist development may be changed with more focus on Sensitivity and LWR. This may potentially provide a new conceptual approach towards EUV PR development for DDRP applications. We have previously demonstrated pattern collapse (PC) mitigation via DDRP on different EUVL photoresists (including different resist platforms), achieving ultimate resolution and exposure latitude improvements [1,2]. In this contribution, we report patterning and material defect performance of HVM compatible (all aqueous) dry development rinse material. We will also report on process window improvement on 2-dimensional metal structures towards standard cell size reduction with elimination of mask layer(s) using single EUV exposure.

Paper Details

Date Published: 7 April 2017
PDF: 8 pages
Proc. SPIE 10143, Extreme Ultraviolet (EUV) Lithography VIII, 101430U (7 April 2017); doi: 10.1117/12.2261741
Show Author Affiliations
Safak Sayan, IMEC (Belgium)
Pieter Vanelderen, IMEC (Belgium)
Iulian Hetel, IMEC (Belgium)
BT Chan, IMEC (Belgium)
Praveen Raghavan, IMEC (Belgium)
Victor Blanco, IMEC (Belgium)
Philippe Foubert, IMEC (Belgium)
Lucia D'urzo, IMEC (Belgium)
Danilo De Simone, IMEC (Belgium)
Geert Vandenberghe, IMEC (Belgium)

Published in SPIE Proceedings Vol. 10143:
Extreme Ultraviolet (EUV) Lithography VIII
Eric M. Panning, Editor(s)

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