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Proceedings Paper

In-line E-beam metrology and defect inspection: industry reflections, hybrid E-beam opportunities, recommendations and predictions
Author(s): Eric Solecky; Allen Rasafar; Jason Cantone; Benjamin Bunday; Alok Vaid; Oliver Patterson; Andrew Stamper; Kevin Wu; Ralf Buengener; Weihao Weng; Xintuo Dai
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Paper Abstract

At SPIE 2013 in Metrology, Inspection, and Process Control for Microlithography an invited paper was published titled “In-line E-beam wafer metrology and defect inspection: the end of an era for image-based critical dimensional metrology? New life for defect inspection”. Three years have passed and numerous developments have occurred as predicted in this paper. The development of E-beam tools that can concurrently handle metrology and defect applications is one of the primary developments. In this paper, the capabilities of these new E-beam tools and their current use cases will be discussed in the areas of Critical Dimension Uniformity (CDU), In-die overlay, Hot spot and Physical defect inspection. Emphasis will be placed on use cases where “massive” CDU data is collected in order to increase yield learning for manufacturing (14nm) and decrease cycles of learning for development (7nm). Additionally, some of the other subject material from the previous publication will also be discussed such as the current state of E-beam critical dimension image fidelity and physical defect detection capabilities. Lastly, future directions and opportunities for In-line E-beam including Multi-beam and/or Multi-column E-beam will be discussed.

Paper Details

Date Published: 28 March 2017
PDF: 18 pages
Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 101450R (28 March 2017); doi: 10.1117/12.2261524
Show Author Affiliations
Eric Solecky, GLOBALFOUNDRIES Inc. (United States)
Allen Rasafar, GLOBALFOUNDRIES Inc. (United States)
Jason Cantone, GLOBALFOUNDRIES Inc. (United States)
Benjamin Bunday, GLOBALFOUNDRIES Inc. (United States)
Alok Vaid, GLOBALFOUNDRIES Inc. (United States)
Oliver Patterson, GLOBALFOUNDRIES Inc. (United States)
Andrew Stamper, GLOBALFOUNDRIES Inc. (United States)
Kevin Wu, GLOBALFOUNDRIES Inc. (United States)
Ralf Buengener, GLOBALFOUNDRIES Inc. (United States)
Weihao Weng, GLOBALFOUNDRIES Inc. (United States)
Xintuo Dai, GLOBALFOUNDRIES Inc. (United States)

Published in SPIE Proceedings Vol. 10145:
Metrology, Inspection, and Process Control for Microlithography XXXI
Martha I. Sanchez, Editor(s)

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