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Proceedings Paper

Modeling and simulation of low-energy electron scattering in organic and inorganic EUV photoresists
Author(s): Alessandro Vaglio Pret; Trey Graves; David Blankenship; John J. Biafore
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Paper Abstract

Alternative photoresist platforms are being developed with the goal of meeting Resolution, Roughness and Sensitivity requirements for EUV lithography. Metal-based materials appear promising due to the high etch resistance, high absorption, and high resolution. However, the exposure mechanism of these materials is quite different from that of organic chemically amplified resists. The current electron-scattering model built into PROLITHTM X6.0 allows a direct comparison of the exposure mechanisms for different resist platforms: in particular, it is now possible to estimate the intrinsic resist uncertainty by evaluating electron, acid shot noise and spatial blurring, while forcing the photon shot noise contribution to zero. A comparison between organic resists and metal-based platforms reveals how the denser nature of the latter help containing the electron scattering in a much closer radius around the absorption event. The consequent electron-reaction (acid generation for photo-active-generator-containing organic materials, ligand dissociation for the metal-oxides) reflects the electron shot noise of the different platforms. The higher absorption combined with lower blur of the metaloxide materials seem to become of crucial importance for the 5 nm technology node and beyond.

Paper Details

Date Published: 27 March 2017
PDF: 16 pages
Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 1014609 (27 March 2017); doi: 10.1117/12.2261434
Show Author Affiliations
Alessandro Vaglio Pret, KLA-Tencor Corp. (United States)
Trey Graves, KLA-Tencor Corp. (United States)
David Blankenship, KLA-Tencor Corp. (United States)
John J. Biafore, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 10146:
Advances in Patterning Materials and Processes XXXIV
Christoph K. Hohle, Editor(s)

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