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Proceedings Paper

A high chi track-compatible DSA for sub-10nm L/S patterning
Author(s): Douglas J. Guerrero; Kaumba Sakavuyi; Kui Xu; Ahmed Gharbi; Raluca Tiron; Isabelle Servin; Laurent Pain; Guillaume Claveau; Harold Stokes Jr.; Masahiko Harumoto; Célia Nicolet; Xavier Chevalier
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Paper Abstract

High chi organic lamellar-forming block copolymers were prepared with 18 nm intrinsic period Lo value. The BCPs were coated on a neutral layer on silicon substrates and were either thermally annealed or exposed to solvent vapors both in a 300mm track. The effect of lowering the glass transition temperature (Tg) on the high chi BCP was investigated. Process temperatures and times were varied. It was found that the BCP having lower Tg exhibits faster kinetics and is able to reach alignment in a shorter time than a similar BCP having higher Tg. Fingerprint defect analysis also shows that the BCP with lower Tg has lower defects. The results show that fingerprint formation can be achieved with either ether or ester type solvents depending on the BCP used. The results show that a track process for solvent annealing of high-χ BCPs is feasible and could provide the path forward for incorporation of BCP in future nodes. Finally, directed self-assembly was demonstrated by implemented high chi polymers on a graphoepitaxy test vehicles. CD and line width roughness was evaluated on patterns with a multiplication factor up to 7.

Paper Details

Date Published: 27 March 2017
PDF: 9 pages
Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 101460W (27 March 2017); doi: 10.1117/12.2261094
Show Author Affiliations
Douglas J. Guerrero, Brewer Science, Inc. (Belgium)
Kaumba Sakavuyi, Brewer Science, Inc. (United States)
Kui Xu, Brewer Science, Inc. (United States)
Ahmed Gharbi, CEA-LETI (France)
Raluca Tiron, CEA-LETI (France)
Isabelle Servin, CEA-LETI (France)
Laurent Pain, CEA-LETI (France)
Guillaume Claveau, CEA-LETI (France)
Harold Stokes Jr., SCREEN Semiconductor Solutions Co., Ltd. (Germany)
Masahiko Harumoto, SCREEN Semiconductor Solutions Co., Ltd. (Germany)
Célia Nicolet, Arkema S.A. (France)
Xavier Chevalier, Arkema S.A. (France)

Published in SPIE Proceedings Vol. 10146:
Advances in Patterning Materials and Processes XXXIV
Christoph K. Hohle, Editor(s)

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