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Proceedings Paper

High-NA optical CD metrology on small in-cell targets enabling improved higher order dose control and process control for logic
Author(s): Hugo Cramer; Elliott Mc Namara; Rik van Laarhoven; Ram Jaganatharaja; Isabel de la Fuente; Sharon Hsu; Filippo Belletti; Milos Popadic; Ward Tu; Wade Huang
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Paper Abstract

The logic manufacturing process requires small in-device metrology targets to exploit the full dose correction potential of the modern scanners and process tools. A high-NA angular resolved scatterometer (YieldStar S-1250D) was modified to demonstrate the possibility of OCD measurements on 5x5µm2 targets. The results obtained on test wafers in a logic manufacturing environment, measured after litho and after core etch, showed a good correlation to larger reference targets and AEI to ADI intra-field CDU correlation, thereby demonstrating the feasibility of OCD on such small targets. The data was used to determine a reduction potential of 55% for the intra-field CD variation, using 145 points per field on a few inner fields, and 33% of the process induced across wafer CD variation using 16 points per field full wafer. In addition, the OCD measurements reveal valuable information on wafer-to-wafer layer height variations within a lot.

Paper Details

Date Published: 28 March 2017
PDF: 9 pages
Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 101451B (28 March 2017); doi: 10.1117/12.2260268
Show Author Affiliations
Hugo Cramer, ASML Netherlands B.V. (Netherlands)
Elliott Mc Namara, ASML Netherlands B.V. (Netherlands)
Rik van Laarhoven, ASML Netherlands B.V. (Netherlands)
Ram Jaganatharaja, ASML Netherlands B.V. (Netherlands)
Isabel de la Fuente, ASML Netherlands B.V. (Netherlands)
Sharon Hsu, ASML Netherlands B.V. (Netherlands)
Filippo Belletti, ASML Netherlands B.V. (Netherlands)
Milos Popadic, ASML Netherlands B.V. (Netherlands)
Ward Tu, ASML Taiwan Ltd. (Taiwan)
Wade Huang, ASML Taiwan Ltd. (Taiwan)

Published in SPIE Proceedings Vol. 10145:
Metrology, Inspection, and Process Control for Microlithography XXXI
Martha I. Sanchez, Editor(s)

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