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Proceedings Paper

EUV process improvement with novel litho track hardware
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Paper Abstract

Currently, there are many developments in the field of EUV lithography that are helping to move it towards increased HVM feasibility. Targeted improvements in hardware design for advanced lithography are of interest to our group specifically for metrics such as CD uniformity, LWR, and defect density. Of course, our work is focused on EUV process steps that are specifically affected by litho track performance, and consequently, can be improved by litho track design improvement and optimization. In this study we are building on our experience to provide continual improvement for LWR, CDU, and Defects as applied to a standard EUV process by employing novel hardware solutions on our SOKUDO DUO coat develop track system. Although it is preferable to achieve such improvements post-etch process we feel, as many do, that improvements after patterning are a precursor to improvements after etching. We hereby present our work utilizing the SOKUDO DUO coat develop track system with an ASML NXE:3300 in the IMEC (Leuven, Belgium) cleanroom environment to improve aggressive dense L/S patterns.

Paper Details

Date Published: 27 March 2017
PDF: 5 pages
Proc. SPIE 10143, Extreme Ultraviolet (EUV) Lithography VIII, 101431Z (27 March 2017); doi: 10.1117/12.2259994
Show Author Affiliations
Harold Stokes, SCREEN SPE Germany GmbH (Germany)
Masahiko Harumoto, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Yuji Tanaka, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Koji Kaneyama, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Charles Pieczulewski, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Masaya Asai, SCREEN Semiconductor Solutions Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 10143:
Extreme Ultraviolet (EUV) Lithography VIII
Eric M. Panning, Editor(s)

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