Share Email Print

Proceedings Paper

Nanoimprint, DSA, and multi-beam lithography: patterning technologies with new integration challenges
Author(s): S. Landis; H. Teyssedre; G. Claveau; I. Servin; F. Delachat; M. L. Pourteau; A. Gharbi; P. Pimenta Barros; R. Tiron; L. Nouri; N. Possemé; M. May; P. Brianceau; S. Barnola; Y. Blancquaert; J. Pradelles; P. Essomba; A. Bernadac; B. Dal'zotto; S. Bos; M. Argoud; G. Chamiot-Maitral; A. Sarrazin; C. Tallaron; C. Lapeyre; L. Pain
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

In the lithography landscape, EUV technology recovered some credibility recently. However, its large adoption remains uncertain. Meanwhile, 193nm immersion lithography, with multiple-patterning strategies, supports the industry preference for advanced-node developments. In this landscape, lithography alternatives maintain promise for continued R&D. Massively parallel electron-beam and nano-imprint lithography techniques remain highly attractive, as they can provide noteworthy cost-of-ownership benefits. Directed self-assembly lithography shows promising resolution capabilities and appears to be an option to reduce multi-patterning strategies. Even if large amount of efforts are dedicated to overcome the lithography side issues, these solutions introduce also new challenges and opportunities for the integration schemes.

Paper Details

Date Published: 10 April 2017
PDF: 13 pages
Proc. SPIE 10149, Advanced Etch Technology for Nanopatterning VI, 101490K (10 April 2017); doi: 10.1117/12.2259966
Show Author Affiliations
S. Landis, CEA-LETI (France)
H. Teyssedre, CEA-LETI (France)
G. Claveau, CEA-LETI (France)
I. Servin, CEA-LETI (France)
F. Delachat, CEA-LETI (France)
M. L. Pourteau, CEA-LETI (France)
A. Gharbi, CEA-LETI (France)
P. Pimenta Barros, CEA-LETI (France)
R. Tiron, CEA-LETI (France)
L. Nouri, CEA-LETI (France)
N. Possemé, CEA-LETI (France)
M. May, CEA-LETI (France)
P. Brianceau, CEA-LETI (France)
S. Barnola, CEA-LETI (France)
Y. Blancquaert, CEA-LETI (France)
J. Pradelles, CEA-LETI (France)
P. Essomba, CEA-LETI (France)
A. Bernadac, CEA-LETI (France)
B. Dal'zotto, CEA-LETI (France)
S. Bos, CEA-LETI (France)
M. Argoud, CEA-LETI (France)
G. Chamiot-Maitral, CEA-LETI (France)
A. Sarrazin, CEA-LETI (France)
C. Tallaron, CEA-LETI (France)
C. Lapeyre, CEA-LETI (France)
L. Pain, CEA-LETI (France)

Published in SPIE Proceedings Vol. 10149:
Advanced Etch Technology for Nanopatterning VI
Sebastian U. Engelmann, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?