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Proceedings Paper

Diagnosis of electronic systems in SMT technological line
Author(s): Marcin Butor; Barbara Dziurdzia
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Paper Abstract

The paper presents test and inspection strategies used in the company Fideltronik Poland, Sucha Beskidzka during the process of assembly of advanced electronic systems. As the example, the manufacturing process of modules for controlling and configuration of charts for video transmission has been analyzed. Various diagnostic methods such as Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), Automated X-ray Inspection AXI and Functional Circuit Test FCT have been used to detect failures at different manufacturing stages of the modules and various repair actions have been proposed .

Paper Details

Date Published: 22 December 2016
PDF: 7 pages
Proc. SPIE 10175, Electron Technology Conference 2016, 1017510 (22 December 2016); doi: 10.1117/12.2258604
Show Author Affiliations
Marcin Butor, Fideltronik Poland Ltd. (Poland)
Barbara Dziurdzia, AGH Univ. of Science and Technology (Poland)

Published in SPIE Proceedings Vol. 10175:
Electron Technology Conference 2016
Barbara Swatowska; Wojciech Maziarz; Tadeusz Pisarkiewicz; Wojciech Kucewicz, Editor(s)

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