
Proceedings Paper
Scanner-to-scanner CD analysis and control in an HVM environmentFormat | Member Price | Non-Member Price |
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Paper Abstract
Shrinking pattern sizes dictate that scanner-to-scanner variations for HVM products shrink proportionally. This paper shows the ability to identify (a subset of) root causes for mismatch between ArF immersion scanners using scanner metrology. The root cause identification was done in a Samsung HVM factory using a methodology (Proximity Matching Budget Breakdown or PromaBB) developed by ASML. The proper identification of root causes-1 helps to select what combination of scanner control parameters should be used to reduce proximity differences of critical patterns while minimizing undesirable side effects from cross-compensation. Using PromaBB, the difference between predicted and measured CD mismatch was below 0.2nm. PromaBB has been proposed for HVM implementation at Samsung in combination with other ASML fab applications: Pattern Matcher Full Chip (PMFC), Image Tuner and FlexWave.
Paper Details
Date Published: 24 March 2017
PDF: 6 pages
Proc. SPIE 10147, Optical Microlithography XXX, 101470A (24 March 2017); doi: 10.1117/12.2258339
Published in SPIE Proceedings Vol. 10147:
Optical Microlithography XXX
Andreas Erdmann; Jongwook Kye, Editor(s)
PDF: 6 pages
Proc. SPIE 10147, Optical Microlithography XXX, 101470A (24 March 2017); doi: 10.1117/12.2258339
Show Author Affiliations
Du Hyun Beak, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Ju Hee Shin, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Tony Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Dong Kyeng Han, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Jin Phil Choi, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Jeong Heung Kong, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Young Seog Kang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Se Yeon Jang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Peter Nikolsky, ASML Netherlands B.V. (Netherlands)
Chris Strolenberg, ASML Netherlands B.V. (Netherlands)
Noh-Kyoung Park, ASML Netherlands B.V. (Netherlands)
Ju Hee Shin, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Tony Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Dong Kyeng Han, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Jin Phil Choi, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Jeong Heung Kong, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Young Seog Kang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Se Yeon Jang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Peter Nikolsky, ASML Netherlands B.V. (Netherlands)
Chris Strolenberg, ASML Netherlands B.V. (Netherlands)
Noh-Kyoung Park, ASML Netherlands B.V. (Netherlands)
Khalid Elbattay, ASML Netherlands B.V. (Netherlands)
Vito Tomasello, ASML Brion (United States)
Austin Peng, ASML Brion (United States)
Anand Guntuka, ASML Brion (United States)
Zhao-Ze Li, ASML Brion (United States)
Ronald Goossens, ASML Brion (United States)
Machi Ryu, ASML Brion (Korea, Republic of)
Jangho Shin, ASML Brion (Korea, Republic of)
Chung-Yong Kim, ASML Korea Co., Ltd. (Korea, Republic of)
Andrew Moe, ASML Korea Co., Ltd. (Korea, Republic of)
Yun-A Sung, ASML Korea Co., Ltd. (Korea, Republic of)
Vito Tomasello, ASML Brion (United States)
Austin Peng, ASML Brion (United States)
Anand Guntuka, ASML Brion (United States)
Zhao-Ze Li, ASML Brion (United States)
Ronald Goossens, ASML Brion (United States)
Machi Ryu, ASML Brion (Korea, Republic of)
Jangho Shin, ASML Brion (Korea, Republic of)
Chung-Yong Kim, ASML Korea Co., Ltd. (Korea, Republic of)
Andrew Moe, ASML Korea Co., Ltd. (Korea, Republic of)
Yun-A Sung, ASML Korea Co., Ltd. (Korea, Republic of)
Published in SPIE Proceedings Vol. 10147:
Optical Microlithography XXX
Andreas Erdmann; Jongwook Kye, Editor(s)
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