
Proceedings Paper
Investigation of 3D photoresist profile effect in self-aligned patterning through virtual fabricationFormat | Member Price | Non-Member Price |
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Paper Abstract
The effects of photoresist sidewall profile and LER on two representative integration schemes were studied through 3D
virtual fabrication: Front-End of Line (FEOL) Fin formation and Back-End of Line (BEOL) Metal line definition. Both
of these processes use self-aligned double patterning (SADP) in pattern definition, and affect the circuit performance
through MOSFET channel shape and parasitic capacitance respectively. In both cases we imposed LER and sidewall
roughness on the photoresist that defines the mandrel at the initial step of the SADP flow using SEMulator3D. The LER
followed a Gaussian correlation function for a number of amplitude and correlation length values. The sidewall profile
emulated the bulb-shaped pattern that is reported in experimental works. The taper angle and roughness amplitude of this
shape were varied to isolate its components. In each of these cases, we have found direct evidence of resist sidewall
profile impact on variability degradation in CD and electrical performance. Special care should be placed on controlling
resist profile through optimization of exposure and development schemes.
Paper Details
Date Published: 24 March 2017
PDF: 8 pages
Proc. SPIE 10147, Optical Microlithography XXX, 101470G (24 March 2017); doi: 10.1117/12.2258157
Published in SPIE Proceedings Vol. 10147:
Optical Microlithography XXX
Andreas Erdmann; Jongwook Kye, Editor(s)
PDF: 8 pages
Proc. SPIE 10147, Optical Microlithography XXX, 101470G (24 March 2017); doi: 10.1117/12.2258157
Show Author Affiliations
Mustafa B. Akbulut, Coventor, Inc. (United States)
Jiangjiang Gu, Coventor, Inc. (United States)
Andras Pap, Coventor, Inc. (United States)
Vasanth Allampalli, Coventor, Inc. (United States)
Jiangjiang Gu, Coventor, Inc. (United States)
Andras Pap, Coventor, Inc. (United States)
Vasanth Allampalli, Coventor, Inc. (United States)
Daniel Faken, Coventor, Inc. (United States)
Joseph Ervin, Coventor, Inc. (United States)
Ken Greiner, Coventor, Inc. (United States)
David Fried, Coventor, Inc. (United States)
Joseph Ervin, Coventor, Inc. (United States)
Ken Greiner, Coventor, Inc. (United States)
David Fried, Coventor, Inc. (United States)
Published in SPIE Proceedings Vol. 10147:
Optical Microlithography XXX
Andreas Erdmann; Jongwook Kye, Editor(s)
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