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Proceedings Paper

High-radiance LDP source for mask inspection and beam line applications (Conference Presentation)
Author(s): Yusuke Teramoto; Bárbara Santos; Guido Mertens; Ralf Kops; Margarete Kops; Alexander von Wezyk; Klaus Bergmann; Hironobu Yabuta; Akihisa Nagano; Noritaka Ashizawa; Yuta Taniguchi; Daiki Yamatani; Takahiro Shirai; Kunihiko Kasama

Paper Abstract

High-throughput actinic mask inspection tools are needed as EUVL begins to enter into volume production phase. One of the key technologies to realize such inspection tools is a high-radiance EUV source of which radiance is supposed to be as high as 100 W/mm2/sr. Ushio is developing laser-assisted discharge-produced plasma (LDP) sources. Ushio’s LDP source is able to provide sufficient radiance as well as cleanliness, stability and reliability. Radiance behind the debris mitigation system was confirmed to be 120 W/mm2/sr at 9 kHz and peak radiance at the plasma was increased to over 200 W/mm2/sr in the recent development which supports high-throughput, high-precision mask inspection in the current and future technology nodes. One of the unique features of Ushio’s LDP source is cleanliness. Cleanliness evaluation using both grazing-incidence Ru mirrors and normal-incidence Mo/Si mirrors showed no considerable damage to the mirrors other than smooth sputtering of the surface at the pace of a few nm per Gpulse. In order to prove the system reliability, several long-term tests were performed. Data recorded during the tests was analyzed to assess two-dimensional radiance stability. In addition, several operating parameters were monitored to figure out which contributes to the radiance stability. The latest model that features a large opening angle was recently developed so that the tool can utilize a large number of debris-free photons behind the debris shield. The model was designed both for beam line application and high-throughput mask inspection application. At the time of publication, the first product is supposed to be in use at the customer site.

Paper Details

Date Published: 5 May 2017
PDF: 1 pages
Proc. SPIE 10143, Extreme Ultraviolet (EUV) Lithography VIII, 101431L (5 May 2017); doi: 10.1117/12.2258139
Show Author Affiliations
Yusuke Teramoto, Ushio Inc. (Germany)
Bárbara Santos, Ushio Inc. (Germany)
Guido Mertens, Ushio Inc. (Germany)
Ralf Kops, Ushio Inc. (Germany)
Margarete Kops, Ushio Inc. (Germany)
Alexander von Wezyk, Fraunhofer-Institut für Lasertechnik (Germany)
Klaus Bergmann, Fraunhofer-Institut für Lasertechnik (Germany)
Hironobu Yabuta, Ushio Inc. (Japan)
Akihisa Nagano, Ushio Inc. (Japan)
Noritaka Ashizawa, Ushio Inc. (Japan)
Yuta Taniguchi, Ushio Inc. (Japan)
Daiki Yamatani, Ushio Inc. (Japan)
Takahiro Shirai, Ushio Inc. (Japan)
Kunihiko Kasama, Ushio Inc. (Japan)

Published in SPIE Proceedings Vol. 10143:
Extreme Ultraviolet (EUV) Lithography VIII
Eric M. Panning, Editor(s)

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