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Proceedings Paper

Redundant via insertion in self-aligned double patterning
Author(s): Youngsoo Song; Jinwook Jung; Youngsoo Shin
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Paper Abstract

Redundant via (RV) insertion is employed to enhance via manufacturability, and has been extensively studied. Self-aligned double patterning (SADP) process, brings a new challenge to RV insertion since newly created cut for each RV insertion has to be taken care of. Specifically, when a cut for RV, which we simply call RV-cut, is formed, cut conflict may occur with nearby line-end cuts, which results in a decrease in RV candidates. We introduce cut merging to reduce the number of cut conflicts; merged cuts are processed with stitch using litho-etch-litho-etch (LELE) multi-patterning method. In this paper, we propose a new RV insertion method with cut merging in SADP for the first time. In our experiments, a simple RV insertion yields 55.3% vias to receives RVs; our proposed method that considers cut merging increases that number to 69.6% on average of test circuits.

Paper Details

Date Published: 28 March 2017
PDF: 8 pages
Proc. SPIE 10148, Design-Process-Technology Co-optimization for Manufacturability XI, 1014806 (28 March 2017); doi: 10.1117/12.2258036
Show Author Affiliations
Youngsoo Song, KAIST (Korea, Republic of)
SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Jinwook Jung, KAIST (Korea, Republic of)
Youngsoo Shin, KAIST (Korea, Republic of)

Published in SPIE Proceedings Vol. 10148:
Design-Process-Technology Co-optimization for Manufacturability XI
Luigi Capodieci; Jason P. Cain, Editor(s)

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