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Proceedings Paper

In-depth analysis of indirect overlay method and applying in production environment
Author(s): Detlef Hofmann; Frank Rabe; Stefan Buhl; Wan-Soo Kim; Boris Habets
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Paper Abstract

Overlay measurements are done for verification of the exposure and creation of process corrections for the next lots. As throughput of the overlay measurement tools is limited, it is desirable to avoid unnecessary measurements. Another concern can be that in-transparent stacks do not allow measuring a critical overlay relation directly. We developed methods for calculation of the overlay relation between two different layers between which there is no direct overlay measurement. We qualify the impact of sampling plans and the number of dependent layers. The indirect overlay calculation is applied on a significant high volume data set.

Paper Details

Date Published: 28 March 2017
PDF: 21 pages
Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 101450E (28 March 2017); doi: 10.1117/12.2257963
Show Author Affiliations
Detlef Hofmann, Infineon Technologies Dresden GmbH (Germany)
Frank Rabe, Infineon Technologies Dresden GmbH (Germany)
Stefan Buhl, Qoniac GmbH (Germany)
Wan-Soo Kim, Qoniac GmbH (Germany)
Boris Habets, Qoniac GmbH (Germany)

Published in SPIE Proceedings Vol. 10145:
Metrology, Inspection, and Process Control for Microlithography XXXI
Martha I. Sanchez, Editor(s)

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