Share Email Print

Proceedings Paper

Patterned wafer geometry grouping for improved overlay control
Author(s): Honggoo Lee; Sangjun Han; Jaeson Woo; Junbeom Park; Changrock Song; Fatima Anis; Pradeep Vukkadala; Sanghuck Jeon; DongSub Choi; Kevin Huang; Hoyoung Heo; Mark D. Smith; John C. Robinson
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Process-induced overlay errors from outside the litho cell have become a significant contributor to the overlay error budget including non-uniform wafer stress. Previous studies have shown the correlation between process-induced stress and overlay and the opportunity for improvement in process control, including the use of patterned wafer geometry (PWG) metrology to reduce stress-induced overlay signatures. Key challenges of volume semiconductor manufacturing are how to improve not only the magnitude of these signatures, but also the wafer to wafer variability. This work involves a novel technique of using PWG metrology to provide improved litho-control by wafer-level grouping based on incoming process induced overlay, relevant for both 3D NAND and DRAM. Examples shown in this study are from 19 nm DRAM manufacturing.

Paper Details

Date Published: 28 March 2017
PDF: 8 pages
Proc. SPIE 10145, Metrology, Inspection, and Process Control for Microlithography XXXI, 101450O (28 March 2017); doi: 10.1117/12.2257834
Show Author Affiliations
Honggoo Lee, SK Hynix, Inc. (Korea, Republic of)
Sangjun Han, SK Hynix, Inc. (Korea, Republic of)
Jaeson Woo, SK Hynix, Inc. (Korea, Republic of)
Junbeom Park, SK Hynix, Inc. (Korea, Republic of)
Changrock Song, SK Hynix, Inc. (Korea, Republic of)
Fatima Anis, KLA-Tencor Corp. (United States)
Pradeep Vukkadala, KLA-Tencor Corp. (United States)
Sanghuck Jeon, KLA-Tencor Korea (Korea, Republic of)
DongSub Choi, KLA-Tencor Korea (Korea, Republic of)
Kevin Huang, KLA-Tencor Corp. (United States)
Hoyoung Heo, KLA-Tencor Corp. (United States)
Mark D. Smith, KLA-Tencor Corp. (United States)
John C. Robinson, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 10145:
Metrology, Inspection, and Process Control for Microlithography XXXI
Martha I. Sanchez, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?