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Proceedings Paper

Hybrid integration of carbon nanotubes in silicon photonic structures
Author(s): E. Durán-Valdeiglesias; W. Zhang; C. Alonso-Ramos; X. Le Roux; S. Serna; H. C. Hoang; D. Marris-Morini; E. Cassan; F. Intonti; F. Sarti; N. Caselli; F. La China; M. Gurioli; M. Balestrieri; L. Vivien; A. Filoramo
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Paper Abstract

Silicon photonics, due to its compatibility with the CMOS platform and unprecedented integration capability, has become the preferred solution for the implementation of next generation optical interconnects to accomplish high efficiency, low energy consumption, low cost and device miniaturization in one single chip. However, it is restricted by silicon itself. Silicon does not have efficient light emission or detection in the telecommunication wavelength range (1.3 μm-1.5 μm) or any electro-optic effect (i.e. Pockels effect). Hence, silicon photonic needs to be complemented with other materials for the realization of optically-active devices, including III-V for lasing and Ge for detection. The very different requirement of these materials results in complex fabrication processes that offset the cost-effectiveness of the Si photonics approach. For this purpose, carbon nanotubes (CNTs) have recently been proposed as an attractive one-dimensional light emitting material. Interestingly, semiconducting single walled CNTs (SWNTs) exhibit room-temperature photo- and electro-luminescence in the near-IR that could be exploited for the implementation of integrated nano-sources. They can also be considered for the realization of photo-detectors and optical modulators, since they rely on intrinsically fast non-linear effects, such as Stark and Kerr effect. All these properties make SWNTs ideal candidates in order to fabricate a large variety of optoelectronic devices, including near-IR sources, modulators and photodetectors on Si photonic platforms. In addition, solution processed SWNTs can be integrated on Si using spin-coating or drop-casting techniques, obviating the need of complex epitaxial growth or chip bonding approaches. Here, we report on our recent progress in the coupling of SWNTs light emission into optical resonators implemented on the silicon-on-insulator (SOI) platform. .

Paper Details

Date Published: 20 February 2017
PDF: 7 pages
Proc. SPIE 10107, Smart Photonic and Optoelectronic Integrated Circuits XIX, 101070K (20 February 2017);
Show Author Affiliations
E. Durán-Valdeiglesias, Ctr. de Nanosciences et de Nanotechnologies, Univ. Paris Sud, CNRS (France)
W. Zhang, Ctr. de Nanosciences et de Nanotechnologies, Univ. Paris Sud, CNRS (France)
C. Alonso-Ramos, Ctr. de Nanosciences et de Nanotechnologies, Univ. Paris Sud, CNRS (France)
X. Le Roux, Ctr. de Nanosciences et de Nanotechnologies, Univ. Paris Sud, CNRS (France)
S. Serna, Ctr. de Nanosciences et de Nanotechnologies, Univ. Paris Sud, CNRS (France)
H. C. Hoang, Ctr. de Nanosciences et de Nanotechnologies, Univ. Paris Sud, CNRS (France)
D. Marris-Morini, Ctr. de Nanosciences et de Nanotechnologies, Univ. Paris Sud, CNRS (France)
E. Cassan, Ctr. de Nanosciences et de Nanotechnologies, Univ. Paris Sud, CNRS (France)
F. Intonti, Univ. degli Studi di Firenze (Italy)
F. Sarti, Univ. degli Studi di Firenze (Italy)
N. Caselli, Univ. degli Studi di Firenze (Italy)
F. La China, Univ. degli Studi di Firenze (Italy)
M. Gurioli, Univ. degli Studi di Firenze (Italy)
M. Balestrieri, LICSEN, NIMBE, CEA, CNRS, Univ. Paris-Saclay (France)
L. Vivien, Ctr. de Nanosciences et de Nanotechnologies, Univ. Paris Sud, CNRS (France)
A. Filoramo, LICSEN, NIMBE, CEA, CNRS, Univ. Paris-Saclay (France)


Published in SPIE Proceedings Vol. 10107:
Smart Photonic and Optoelectronic Integrated Circuits XIX
Louay A. Eldada; El-Hang Lee; Sailing He, Editor(s)

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