Laser systems face massive economic challenges for cost effective, but yet ultraprecise assembly processes. Costs are mainly driven by the final assembly requirements of laser systems. Most challenging in this context is the robust process control of the UV-curing adhesive bonding process. The work presented aims for a significant reduction of the impact of shrinkage effects during curing and a resulting increase in assembly precision. Key approaches are integrated and characterized curing systems, ultraprecise dispensing processes and the automated characterization of adhesive shrinkage magnitude. These technologies allow for reproducible adhesive bonding processes in prototyping, job-shop assembly and automated assembly cells.

Date Published: 25 May 2017
PDF: 1 pages
Proc. SPIE 10085, Components and Packaging for Laser Systems III, 100850E (25 May 2017); doi: 10.1117/12.2253595

Published in SPIE Proceedings Vol. 10085:
Components and Packaging for Laser Systems III
Alexei L. Glebov; Paul O. Leisher, Editor(s)