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Proceedings Paper

Laser direct writing of carbon/Au composite electrodes for high-performance micro-supercapacitors
Author(s): Jinguang Cai; Akira Watanabe; Chao Lv
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Paper Abstract

Micro-supercapacitors with small size, light weight, flexibility while maintaining high energy and power output are required for portable miniaturized electronics. The fabrication methods and materials should be cost-effective, scalable, and easily integrated to current electronic industry. Carbon materials have required properties for high-performance flexible supercapacitors, including high specific surface areas, electrochemical stability, and high electrical conductivity, as well as the high mechanical tolerance. Laser direct writing method is a non-contact, efficient, single-step fabrication technique without requirements of masks, post-processing, and complex clean room, which is a useful patterning technique, and can be easily integrated with current electronic product lines for commercial use. Previously we have reported micro-supercapacitors fabricated by laser direct writing on polyimide films in air or Ar, which showed highcapacitive performance. However, the conductivity of the carbon materials is still low for fast charge-discharge use. Here, we demonstrated the fabrication of flexible carbon/Au composite high-performance MSCs by first laser direct writing on commercial polyimide films followed by spin-coating Au nanoparticles ink and second in-situ laser direct writing using the low-cost semiconductor laser. As-prepared micro-supercapacitors show an improved conductivity and capacitance of 1.17 mF/cm2 at a high scanning rate of 10,000 mV/s, which is comparable to the reported capacitance of carbon-based micro-supercapacitors. In addition, the micro-supercapacitors have high bend tolerance and long-cycle stability.

Paper Details

Date Published: 17 February 2017
PDF: 8 pages
Proc. SPIE 10092, Laser-based Micro- and Nanoprocessing XI, 100920P (17 February 2017); doi: 10.1117/12.2251151
Show Author Affiliations
Jinguang Cai, China Academy of Engineering Physics (China)
Tohoku Univ. (Japan)
Akira Watanabe, Tohoku Univ. (Japan)
Chao Lv, China Academy of Engineering Physics (China)
Tohoku Univ. (Japan)

Published in SPIE Proceedings Vol. 10092:
Laser-based Micro- and Nanoprocessing XI
Udo Klotzbach; Kunihiko Washio; Rainer Kling, Editor(s)

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