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Proceedings Paper

Thick-SOI Echelle grating for any-to-any wavelength routing interconnection in multi-socket computing environments
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Paper Abstract

As data centers constantly expand, electronic switches are facing the challenge of enhanced scalability and the request for increased pin-count and bandwidth. Photonic technology and wavelength division multiplexing have always been a strong alternative for efficient routing and their potential was already proven in the telecoms. CWDM transceivers have emerged in the board-to-board level interconnection, revealing the potential for wavelength-routing to be applied in the datacom and an AWGR-based approach has recently been proposed towards building an optical multi-socket interconnection to offer any-to-any connectivity with high aggregated throughput and reduced power consumption.

Echelle gratings have long been recognized as the multiplexing block exhibiting smallest footprint and robustness in a wide number of applications compared to other alternatives such as the Arrayed Waveguide Grating. Such filtering devices can also perform in a similar way to cyclical AWGR and serve as mid-board routing platforms in multi-socket environments. In this communication, we present such a 3x3 Echelle grating integrated on thick SOI platform with aluminum-coated facets that is shown to perform successful wavelength-routing functionality at 10 Gb/s. The device exhibits a footprint of 60x270 μm2, while the static characterization showed a 3 dB on–chip loss for the best channel. The 3 dB-bandwidth of the channels was 4.5 nm and the free spectral range was 90 nm. The echelle was evaluated in a 2x2 wavelength routing topology, exhibiting a power penalty of below 0.4 dB at 10-9 BER for the C-band. Further experimental evaluations of the platform involve commercially available CWDM datacenter transceivers, towards emulating an optically-interconnected multi-socket environment traffic scenario.

Paper Details

Date Published: 20 February 2017
PDF: 6 pages
Proc. SPIE 10109, Optical Interconnects XVII, 1010914 (20 February 2017); doi: 10.1117/12.2250772
Show Author Affiliations
G. Dabos, Aristotle Univ. of Thessaloniki (Greece)
S. Pitris, Aristotle Univ. of Thessaloniki (Greece)
C. Mitsolidou, Aristotle Univ. of Thessaloniki (Greece)
T. Alexoudi, Aristotle Univ. of Thessaloniki (Greece)
D. Fitsios, Aristotle Univ. of Thessaloniki (Greece)
M. Cherchi, VTT Technical Research Ctr. of Finland Ltd. (Finland)
M. Harjanne, VTT Technical Research Ctr. of Finland Ltd. (Finland)
T. Aalto, VTT Technical Research Ctr. of Finland Ltd. (Finland)
G. T. Kanellos, Aristotle Univ. of Thessaloniki (Greece)
N. Pleros, Aristotle Univ. of Thessaloniki (Greece)

Published in SPIE Proceedings Vol. 10109:
Optical Interconnects XVII
Henning Schröder; Ray T. Chen, Editor(s)

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