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Proceedings Paper

193nm high power lasers for the wide bandgap material processing
Author(s): Junichi Fujimoto; Masakazu Kobayashi; Koji Kakizaki; Hiroaki Oizumi; Toshio Mimura; Takashi Matsunaga; Hakaru Mizoguchi
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Paper Abstract

Recently infrared laser has faced resolution limit of finer micromachining requirement on especially semiconductor packaging like Fan-Out Wafer Level Package (FO-WLP) and Through Glass Via hole (TGV) which are hard to process with less defect. In this study, we investigated ablation rate with deep ultra violet excimer laser to explore its possibilities of micromachining on organic and glass interposers. These results were observed with a laser microscopy and Scanning Electron Microscope (SEM). As the ablation rates of both materials were quite affordable value, excimer laser is expected to be put in practical use for mass production.

Paper Details

Date Published: 22 February 2017
PDF: 10 pages
Proc. SPIE 10097, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VI, 100970T (22 February 2017); doi: 10.1117/12.2250706
Show Author Affiliations
Junichi Fujimoto, Gigaphoton Inc. (Japan)
Masakazu Kobayashi, Gigaphoton Inc. (Japan)
Koji Kakizaki, Gigaphoton Inc. (Japan)
Hiroaki Oizumi, Gigaphoton Inc. (Japan)
Toshio Mimura, Gigaphoton Inc. (Japan)
Takashi Matsunaga, Gigaphoton Inc. (Japan)
Hakaru Mizoguchi, Gigaphoton Inc. (Japan)


Published in SPIE Proceedings Vol. 10097:
High-Power Laser Materials Processing: Applications, Diagnostics, and Systems VI
Stefan Kaierle; Stefan W. Heinemann, Editor(s)

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