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Proceedings Paper

Compact packaging of pulsed 1-micron and 1.55-micron fiber amplifiers (Conference Presentation)
Author(s): Daniel Creeden; Julia Limongelli; Jon Blanchard; Adam Marcinuk; Benjamin R. Johnson; Scott D. Setzler

Paper Abstract

We have developed a packaged fiber amplifier configuration that allows for nearly two orders of magnitude of pulse width adjustment from 1ns to >800ns. This has been developed for both the 1-micron and 1.55-micron spectral regions. Our 1.55-micron fiber laser is packaged into a 6.63 x 8.65 x 3.47 in3 box, while our 1-micron fiber laser is packaged into a 13.68 x 8.68 x 3.56 in3 box, with the larger package a result of larger fiber components. These lasers offer a wide range of adjustable operating points, with total output ultimately limited by available pump power. For 1ns pulses, our 1.55-micron system generates up to 6μJ of pulse energy (>6kW peak) with transform-limited spectral output. Higher energies and output powers are achievable (up to 33μJ at 25kW peak), but the spectral output broadens slightly due to nonlinearities with <5ns pulse durations. For 1ns pulses at 1-micron, the system can generate 10uJ pulse energy (>10kW peak) with high spectral purity. At >10ns pulse durations, the same laser can generate up to 40μJ pulse energy (pump limited). A unique aspect of our design is that a single fiber laser package can be electrically adjusted to produce the full range of pulse widths at repetition rates ranging from 100kHz to <1MHz with well-behaved output pulse shapes and no rising-edge pulse distortions typically seen in high gain amplifiers. In this paper, we discuss our laser architecture, performance, packaging layout, packaging limitations, and a path toward more compact designs using standard fiber components.

Paper Details

Date Published: 21 April 2017
PDF: 1 pages
Proc. SPIE 10085, Components and Packaging for Laser Systems III, 100850V (21 April 2017); doi: 10.1117/12.2250409
Show Author Affiliations
Daniel Creeden, BAE Systems (United States)
Julia Limongelli, BAE Systems (United States)
Jon Blanchard, BAE Systems (United States)
Adam Marcinuk, BAE Systems (United States)
Benjamin R. Johnson, BAE Systems (United States)
Scott D. Setzler, BAE Systems (United States)

Published in SPIE Proceedings Vol. 10085:
Components and Packaging for Laser Systems III
Alexei L. Glebov; Paul O. Leisher, Editor(s)

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