Proceedings Paper
The smile effect reduction of diode laser bar by bare bar curve control| Format | Member Price | Non-Member Price |
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Paper Abstract
To reduce the diode laser bar’s smile effect induced by packaging, a method based on a chip mounter is presented. When the bare bar is picked up by the pick-up tool (PUT) of the chip mounter, the curve direction and volume of the bar can be measured by scanning the P side surface of the bar with a laser rangefinder, and they can be controlled through adjusting the setting up of the PUT. By controlling the curve direction and volume at an appropriate state to compensate the packaging induced strain, the obtaining smile effect is restricted within 0.5μm steadily.
Paper Details
Date Published: 22 February 2017
PDF: 5 pages
Proc. SPIE 10085, Components and Packaging for Laser Systems III, 100850D (22 February 2017); doi: 10.1117/12.2250017
Published in SPIE Proceedings Vol. 10085:
Components and Packaging for Laser Systems III
Alexei L. Glebov; Paul O. Leisher, Editor(s)
PDF: 5 pages
Proc. SPIE 10085, Components and Packaging for Laser Systems III, 100850D (22 February 2017); doi: 10.1117/12.2250017
Show Author Affiliations
Guannan Jia, Beijing Univ. of Technology (China)
Shun Yao, Beijing Univ. of Technology (China)
Xiaoying Luo, Beijing Univ. of Technology (China)
Shun Yao, Beijing Univ. of Technology (China)
Xiaoying Luo, Beijing Univ. of Technology (China)
Jian Cheng, Beijing Univ. of Technology (China)
Zhiyong Wang, Beijing Univ. of Technology (China)
Zhiyong Wang, Beijing Univ. of Technology (China)
Published in SPIE Proceedings Vol. 10085:
Components and Packaging for Laser Systems III
Alexei L. Glebov; Paul O. Leisher, Editor(s)
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