Share Email Print

Proceedings Paper

The future of 2D metrology for display manufacturing
Author(s): Tor Sandstrom; Mikael Wahlsten; Youngjin Park
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The race to 800 PPI and higher in mobile devices and the transition to OLED displays are driving a dramatic development of mask quality: resolution, CDU, registration, and complexity. 2D metrology for large area masks is necessary and must follow the roadmap. Driving forces in the market place point to continued development of even more dense displays. State-of-the-art metrology has proven itself capable of overlay below 40 nm and registration below 65 nm for G6 masks.

Future developments include incoming and recurrent measurements of pellicalized masks at the panel maker’s factory site. Standardization of coordinate systems across supplier networks is feasible. This will enable better yield and production economy for both mask and panel maker. Better distortion correction methods will give better registration on the panels and relax the flatness requirements of the mask blanks. If panels are measured together with masks and the results are used to characterize the aligners, further quality and yield improvements are possible.

Possible future developments include in-cell metrology and integration with other instruments in the same platform.

Paper Details

Date Published: 20 October 2016
PDF: 12 pages
Proc. SPIE 10032, 32nd European Mask and Lithography Conference, 1003208 (20 October 2016); doi: 10.1117/12.2248951
Show Author Affiliations
Tor Sandstrom, Mycronic AB (Sweden)
Mikael Wahlsten, Mycronic AB (Sweden)
Youngjin Park, Mycronic AB (Sweden)

Published in SPIE Proceedings Vol. 10032:
32nd European Mask and Lithography Conference
Uwe F.W. Behringer; Jo Finders, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?