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Proceedings Paper

High-aspect ratio laser drilling of glass assisted by supercritical carbon dioxide
Author(s): Keisuke Yoshiki
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Paper Abstract

We propose a novel high aspect laser drilling technique for glass substrate assisted by supercritical CO2 instead of water. Supercritical CO2 has excellent solubility and fluidity, which facilitates efficient removal of ablated debris to the outside of the drilled hole. Thus, laser drilling using supercritical CO2 results in deeper, thinner holes than those drilled using air and water. In experiments conducted, glass slab was placed in an enclosure filled with CO2 around the critical point. Subsequently, a sub-picosecond pulsed laser focused and scanned on the sample created deeper and thinner holes with aspect ratios greater than 100.

Paper Details

Date Published: 17 February 2017
PDF: 6 pages
Proc. SPIE 10092, Laser-based Micro- and Nanoprocessing XI, 100921K (17 February 2017); doi: 10.1117/12.2248515
Show Author Affiliations
Keisuke Yoshiki, Univ. of Hyogo (Japan)

Published in SPIE Proceedings Vol. 10092:
Laser-based Micro- and Nanoprocessing XI
Udo Klotzbach; Kunihiko Washio; Rainer Kling, Editor(s)

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