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Proceedings Paper

High power DUV lasers for material processing
Author(s): Toshio Mimura; Kouji Kakizaki; Hiroaki Oizumi; Masakazu Kobayashi; Junichi Fujimoto; Takashi Matsunaga; Hakaru Mizoguchi
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Paper Abstract

A frontier in laser machining has been required by material processing in DUV region because it is hard to get high power solid-state lasers in this spectral region. DUV excimer lasers are the only solution, and now the time has come to examine the new applications of material processing with DUV excimer lasers. The excimer lasers at 193nm and 248nm have been used in the semiconductor manufacturing for long years, and have field-proven stability and reliability. The high photon energy of 6.4 eV at 193nm is expected to interact directly with the chemical bond of hard-machining materials, such as CFRP, diamond and tempered glasses. We report the latest results of material processing by 193nm high power DUV laser.

Paper Details

Date Published: 9 November 2016
PDF: 7 pages
Proc. SPIE 10016, High-Power Lasers and Applications VIII, 1001603 (9 November 2016); doi: 10.1117/12.2247870
Show Author Affiliations
Toshio Mimura, Gigaphoton Inc. (Japan)
Kouji Kakizaki, Gigaphoton Inc. (Japan)
Hiroaki Oizumi, Gigaphoton Inc. (Japan)
Masakazu Kobayashi, Gigaphoton Inc. (Japan)
Junichi Fujimoto, Gigaphoton Inc. (Japan)
Takashi Matsunaga, Gigaphoton Inc. (Japan)
Hakaru Mizoguchi, Gigaphoton Inc. (Japan)

Published in SPIE Proceedings Vol. 10016:
High-Power Lasers and Applications VIII
Ruxin Li; Upendra N. Singh; Robert F. Walter, Editor(s)

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