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Proceedings Paper

Identification of a new source of reticle contamination
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Paper Abstract

Since the introduction of 248 and 193 nm lithography sub-pellicle contamination has been a significant problem and a major contributor to reticle costs and semiconductor yield losses. The most common contaminant identified has been ammonium sulfate commonly called haze, however there have been many other contaminants identified and grouped in the category as haze. In attempts to mitigate the cause of this problem various processes and manufacturing protocols have been put in place to either prevent the problem or identify the source of the problem before there is a negative impact in the wafer fab. In spite of efforts to manage the effects of sub-pellicle contamination in the wafer fab, the problem continues to exist. Over the years we have identified many of the compounds and their sources that exist on the sub-pellicle surface, however one has been elusive. This paper will provide both the identification of this compound and its source.

Paper Details

Date Published: 4 October 2016
PDF: 10 pages
Proc. SPIE 9985, Photomask Technology 2016, 998516 (4 October 2016); doi: 10.1117/12.2247576
Show Author Affiliations
Brian J. Grenon, RAVE, LLC (United States)
David Brinkley, RAVE, LLC (United States)

Published in SPIE Proceedings Vol. 9985:
Photomask Technology 2016
Bryan S. Kasprowicz; Peter D. Buck, Editor(s)

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