
Proceedings Paper
Study on electroplating technology of diamond tools for machining hard and brittle materialsFormat | Member Price | Non-Member Price |
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Paper Abstract
With the development of the high speed cutting, the ultra-precision machining and ultrasonic vibration technique in processing hard and brittle material , the requirement of cutting tools is becoming higher and higher. As electroplated diamond tools have distinct advantages, such as high adaptability, high durability, long service life and good dimensional stability, the cutting tools are effective and extensive used in grinding hard and brittle materials. In this paper, the coating structure of electroplating diamond tool is described. The electroplating process flow is presented, and the influence of pretreatment on the machining quality is analyzed. Through the experimental research and summary, the reasonable formula of the electrolyte, the electroplating technologic parameters and the suitable sanding method were determined. Meanwhile, the drilling experiment on glass-ceramic shows that the electroplating process can effectively improve the cutting performance of diamond tools. It has laid a good foundation for further improving the quality and efficiency of the machining of hard and brittle materials.
Paper Details
Date Published: 28 October 2016
PDF: 5 pages
Proc. SPIE 9683, 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 96832A (28 October 2016); doi: 10.1117/12.2246281
Published in SPIE Proceedings Vol. 9683:
8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
Wenhan Jiang; Li Yang; Oltmann Riemer; Shengyi Li; Yongjian Wan, Editor(s)
PDF: 5 pages
Proc. SPIE 9683, 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 96832A (28 October 2016); doi: 10.1117/12.2246281
Show Author Affiliations
Ying Cui, Tianjin Jinhang Institute of Technical Physics (China)
Tianjin Key Lab. of Optical Thin Film (China)
Jian Hua Chen, Tianjin Jinhang Institute of Technical Physics (China)
Tianjin Key Lab. of Optical Thin Film (China)
Tianjin Key Lab. of Optical Thin Film (China)
Jian Hua Chen, Tianjin Jinhang Institute of Technical Physics (China)
Tianjin Key Lab. of Optical Thin Film (China)
Li Peng Sun, Tianjin Jinhang Institute of Technical Physics (China)
Tianjin Key Lab. of Optical Thin Film (China)
Yue Wang, Tianjin Jinhang Institute of Technical Physics (China)
Tianjin Key Lab. of Optical Thin Film (China)
Tianjin Key Lab. of Optical Thin Film (China)
Yue Wang, Tianjin Jinhang Institute of Technical Physics (China)
Tianjin Key Lab. of Optical Thin Film (China)
Published in SPIE Proceedings Vol. 9683:
8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
Wenhan Jiang; Li Yang; Oltmann Riemer; Shengyi Li; Yongjian Wan, Editor(s)
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