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Proceedings Paper

W/Cu joining strengthened by femtosecond laser-induced micron-scale interface structure
Author(s): Dafa Jiang; Dingwei Gong; Jiangyou Long; Peixun Fan; Hongjun Zhang; Minlin Zhong
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Paper Abstract

W/Cu joining is key for the fabrication of high heat load components for fusion reactors, which however suffers from the low W/Cu bonding strength due to the immiscible nature of W-Cu system. In this study, we proposed a method for strengthened W/Cu joining based on femtosecond (fs) laser induced micron-scale W/Cu interface structure. W surfaces were irradiated by fs laser to form micron-scale cubes array, and then joined to Cu by hot pressing at 1000 °C, 80 MPa for 2.5 hours. The tensile strength of the W/Cu joining samples was investigated. The results show that micron-scale cubes array was successfully introduced into W/Cu interface without any cracks or pores. The interface structure helps to increase the W/Cu bonding strength to as high as 59.61 MPa, increased by about 50% as compared to W/Cu joining with a flat interface (bonding strength 40.11 MPa). The W/Cu bonding strength shows positive correlation with the W/Cu interface area, indicating the possibility to control the W/Cu bonding strength by simply adjusting the fs laser ablation parameters for the fabrication of cubes array on W surface. Our research provides a method for strengthened joining between intrinsically immiscible materials, including but not limited to W and Cu.

Paper Details

Date Published: 9 November 2016
PDF: 11 pages
Proc. SPIE 10018, Advanced Laser Processing and Manufacturing, 1001805 (9 November 2016); doi: 10.1117/12.2246201
Show Author Affiliations
Dafa Jiang, Tsinghua Univ. (China)
Dingwei Gong, Tsinghua Univ. (China)
Jiangyou Long, Tsinghua Univ. (China)
Peixun Fan, Tsinghua Univ. (China)
Hongjun Zhang, Tsinghua Univ. (China)
Minlin Zhong, Tsinghua Univ. (China)

Published in SPIE Proceedings Vol. 10018:
Advanced Laser Processing and Manufacturing
Minlin Zhong; Jonathan Lawrence; Minghui Hong; Jian Liu, Editor(s)

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