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Proceedings Paper

Temperature measurements of high power LEDs
Author(s): Niculina Badalan (Draghici); Paul Svasta; Andrei Drumea
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Paper Abstract

Measurement of a LED junction temperature is very important in designing a LED lighting system. Depending on the junction temperature we will be able to determine the type of cooling system and the size of the lighting system. There are several indirect methods for junction temperature measurement. The method used in this paper is based on the thermal resistance model. The aim of this study is to identify the best device that would allow measuring the solder point temperature and the temperature on the lens of power LEDs. For this purpose four devices for measuring temperature on a high-power LED are presented and compared according to the acquired measurements: an infrared thermal camera from FLIR Systems, a multimeter with K type thermocouple (Velleman DVM4200), an infrared-spot based noncontact thermometer (Raynger ST) and a measurement system based on a digital temperature sensor (DS1821 type) connected to a PC. The measurements were conducted on an 18W COB (chip-on-board) LED. The measurement points are the supply terminals and the lens of the LED.

Paper Details

Date Published: 14 December 2016
PDF: 6 pages
Proc. SPIE 10010, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VIII, 1001019 (14 December 2016); doi: 10.1117/12.2245729
Show Author Affiliations
Niculina Badalan (Draghici), Univ. Politehnica of Bucharest (Romania)
Paul Svasta, Univ. Politehnica of Bucharest (Romania)
Andrei Drumea, Univ. Politehnica of Bucharest (Romania)


Published in SPIE Proceedings Vol. 10010:
Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VIII
Marian Vladescu; Cornel T. Panait; Razvan Tamas; George Caruntu; Ionica Cristea, Editor(s)

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