Proceedings Paper
Functionalization of MEMS cantilever beams for interconnect reliability investigation: development practice| Format | Member Price | Non-Member Price |
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Paper Abstract
This paper covers research results on development of the cantilevers beams test structures for interconnects reliability and robustness investigation. Presented results include design, modelling, simulation, optimization and finally fabrication stage performed on 4 inch Si wafers using the ITE microfabrication facility. This paper also covers experimental results from the test structures characterization.
Paper Details
Date Published: 10 November 2016
PDF: 8 pages
Proc. SPIE 10161, 14th International Conference on Optical and Electronic Sensors, 1016103 (10 November 2016); doi: 10.1117/12.2244299
Published in SPIE Proceedings Vol. 10161:
14th International Conference on Optical and Electronic Sensors
Piotr Jasiński, Editor(s)
PDF: 8 pages
Proc. SPIE 10161, 14th International Conference on Optical and Electronic Sensors, 1016103 (10 November 2016); doi: 10.1117/12.2244299
Show Author Affiliations
T. Bieniek, Instytut Technologii Elektronowej (Poland)
G. Janczyk, Instytut Technologii Elektronowej (Poland)
Warsaw Univ. of Technology (Poland)
R. Dobrowolski, Instytut Technologii Elektronowej (Poland)
K. Wojciechowska, Instytut Technologii Elektronowej (Poland)
G. Janczyk, Instytut Technologii Elektronowej (Poland)
Warsaw Univ. of Technology (Poland)
R. Dobrowolski, Instytut Technologii Elektronowej (Poland)
K. Wojciechowska, Instytut Technologii Elektronowej (Poland)
Published in SPIE Proceedings Vol. 10161:
14th International Conference on Optical and Electronic Sensors
Piotr Jasiński, Editor(s)
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