We discuss the depth of subsurface damage (SSD) on different processing conditions. Considering different conditions would produce different depths of SSD, this article seriously studies the depth influenced by different sizes of abrasive particles and different grinding discs. Then the depth of SSD would be detected via Three-Coordinate Measuring Machine (CMM) after traditional polishing. The target of this research is to provide some basic references for the choice of the glass-ceramics grinding machining process.

Date Published: 28 October 2016
PDF: 6 pages
Proc. SPIE 9683, 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 96831B (28 October 2016); doi: 10.1117/12.2241624

Published in SPIE Proceedings Vol. 9683:
8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies
Wenhan Jiang; Li Yang; Oltmann Riemer; Shengyi Li; Yongjian Wan, Editor(s)