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Proceedings Paper

Megasonic cleaning strategy for sub-10nm photomasks
Author(s): Jyh-Wei Hsu; Martin Samayoa; Peter Dress; Uwe Dietze; Ai-Jay Ma; Chia-Shih Lin; Rick Lai; Peter Chang; Laurent Tuo
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Paper Abstract

One of the main challenges in photomask cleaning is balancing particle removal efficiency (PRE) with pattern damage control. To overcome this challenge, a high frequency megasonic cleaning strategy is implemented. Apart from megasonic frequency and power, photomask surface conditioning also influences cleaning performance. With improved wettability, cleanliness is enhanced while pattern damage risk is simultaneously reduced. Therefore, a particle removal process based on higher megasonic frequencies, combined with proper surface pre-treatment, provides improved cleanliness without the unintended side effects of pattern damage, thus supporting the extension of megasonic cleaning technology into 10nm half pitch (hp) device node and beyond.

Paper Details

Date Published: 4 October 2016
PDF: 7 pages
Proc. SPIE 9985, Photomask Technology 2016, 998515 (4 October 2016); doi: 10.1117/12.2241143
Show Author Affiliations
Jyh-Wei Hsu, SUSS MicroTec Inc. (Taiwan)
Martin Samayoa, SUSS MicroTec Inc. (United States)
Peter Dress, SUSS MicroTec Photomask Equipment (Germany)
Uwe Dietze, SUSS MicroTec Inc. (United States)
Ai-Jay Ma, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Chia-Shih Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Rick Lai, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Peter Chang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Laurent Tuo, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)

Published in SPIE Proceedings Vol. 9985:
Photomask Technology 2016
Bryan S. Kasprowicz; Peter D. Buck, Editor(s)

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