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Proceedings Paper

High-speed 3D inspection system for solder bumps
Author(s): Hiroyuki Tsukahara; Youji Nishiyama; Fumiyuki Takahashi; Takashi Fuse; Moritoshi Ando; Tohru Nishino
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Paper Abstract

This paper discusses a high-speed 3-D inspection system for solder-bumps. The system uses a high-speed 3-D sensor system and an accurate measurement algorithm. Solder-bumps have recently been used for flip-chip bonding. Before bonding all bumps need their height and diameter inspected and if bumps are too big or too small, there is a danger of short or open circuits occurring after bonding on the substrate electrodes. Thus, a 100% inspection is required to assure high flip-chip bonding process yields. We developed a laser-based high- speed bump height capture system and an accurate bump height and diameter measurement algorithm. The inspection system takes 20 milliseconds to measure the height and diameter of a bump. It measures the bump height to an accuracy of plus or minus 3 micrometer, and the bump diameter to plus or minus 5 micrometer. Thus, this system is suitable for performing a 100% inspection of solder-bumps.

Paper Details

Date Published: 3 October 1995
PDF: 10 pages
Proc. SPIE 2597, Machine Vision Applications, Architectures, and Systems Integration IV, (3 October 1995); doi: 10.1117/12.223978
Show Author Affiliations
Hiroyuki Tsukahara, Fujitsu Labs. Ltd. (Japan)
Youji Nishiyama, Fujitsu Labs. Ltd. (Japan)
Fumiyuki Takahashi, Fujitsu Labs. Ltd. (Japan)
Takashi Fuse, Fujitsu Labs. Ltd. (Japan)
Moritoshi Ando, Fujitsu Labs. Ltd. (Japan)
Tohru Nishino, Fujitsu Ltd. (Japan)

Published in SPIE Proceedings Vol. 2597:
Machine Vision Applications, Architectures, and Systems Integration IV
Bruce G. Batchelor; Susan Snell Solomon; Frederick M. Waltz, Editor(s)

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